DocumentCode
618545
Title
Physical planning for the architectural exploration of large-scale chip multiprocessors
Author
de San Pedro, Javier ; Nikitin, Nikita ; Cortadella, Jordi ; Petit, Jonathan
Author_Institution
Univ. Politec. de Catalunya, Barcelona, Spain
fYear
2013
fDate
21-24 April 2013
Firstpage
1
Lastpage
2
Abstract
This paper presents an integrated flow for architectural exploration and physical planning of large-scale hierarchical tiled CMPs. Classical floorplanning and wire planning techniques have been adapted to incorporate layout constraints that enforce regularity in the interconnect networks. Routing is performed on top of memories and components that underutilize the available metal layers for interconnectivity. The experiments demonstrate the impact of physical parameters in the selection of the most efficient architectures. Thus, the integrated flow contributes to deliver physically-viable architectures and simplify the complex design closure of large-scale CMPs.
Keywords
circuit layout; microprocessor chips; multiprocessor interconnection networks; network routing; CMP; architectural exploration; floorplanning; interconnect networks; large-scale chip multiprocessors; layout constraints; physical planning; routing; wire planning; Analytical models; Computer architecture; Estimation; Metals; Planning; Throughput; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Networks on Chip (NoCS), 2013 Seventh IEEE/ACM International Symposium on
Conference_Location
Tempe, AZ
Print_ISBN
978-1-4673-6491-1
Electronic_ISBN
978-1-4673-6492-8
Type
conf
DOI
10.1109/NoCS.2013.6558399
Filename
6558399
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