Title :
Leveraging the geometric properties of on-chip transmission line structures to improve interconnect performance: A case study in 65nm
Author :
Das, S. ; Manetas, Georgios ; Stevens, Kenneth S. ; Suaya, Roberto
Abstract :
Implementation of low energy, low latency transmission line interconnects on a network-on-chip presents the circuit designer with a variety of structural design choices. This work presents a study of the comparative effects of changing the wire geometries on the latency, energy dissipated, area, and noise properties of the transmission lines. These results will aid the engineer in the design and performance analysis of the global interconnect and foster a quantitative understanding of the wave signaling properties in the RLC regime.
Keywords :
geometry; integrated circuit interconnections; network-on-chip; transmission lines; geometric properties; interconnect performance; network-on-chip; on-chip transmission line structures; size 65 nm; transmission line interconnects; Conductors; Integrated circuit interconnections; Metals; Microstrip; Noise; Substrates; Wires;
Conference_Titel :
Networks on Chip (NoCS), 2013 Seventh IEEE/ACM International Symposium on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-6491-1
Electronic_ISBN :
978-1-4673-6492-8
DOI :
10.1109/NoCS.2013.6558408
