DocumentCode :
618606
Title :
Characterization of temperature effects on single-photon avalanche diodes fabricated in a HV-CMOS conventional technology
Author :
Vilella, Eva ; Alonso, Omar ; Montiel, A. ; Dieguez, Angel
Author_Institution :
Dept. of Electron., Univ. de Barcelona, Barcelona, Spain
fYear :
2013
fDate :
16-18 April 2013
Firstpage :
1
Lastpage :
5
Abstract :
This paper presents the thermal characterization of a CMOS SPAD (Single-Photon Avalanche PhotoDiode) detector. The sensor and the readout electronics have been monolithically integrated with a conventional 0.35μm HV-CMOS process. In-pixel electronics allow to operate the device in a time-gated mode to reduce the probability to detect the sensor noise within a given frame. The thermal effects on the device have been characterized for two different reverse bias overvoltages of 1.0V and 2.0V within the temperature range between -20°C and 60°C. It will be demonstrated in this paper that the combination of time-gating the sensor in the nanosecond scale with the reduction of the working temperature to -20°C decreases in 5 orders of magnitude the expected noise counts per frame with respect to the continuous operation at room temperature.
Keywords :
BiCMOS integrated circuits; CMOS image sensors; avalanche photodiodes; integrated circuit noise; nanosensors; photodetectors; probability; readout electronics; CMOS SPAD detector; CMOS image sensor; HV-CMOS conventional technology; in-pixel electronics; nanosecond scale; probability; readout electronics; sensor noise detection; single-photon avalanche photodiode; size 0.35 mum; temperature -20 degC to 60 degC; temperature 293 K to 298 K; temperature effect characterization; thermal characterization; time-gated mode; voltage 1.0 V; voltage 2.0 V; CMOS integrated circuits; Detectors; Logic gates; Noise; Surges; Temperature measurement; Temperature sensors; CMOS image sensor; SPAD arrays; dark count rate; low-noise; thermal effects; time-gated operation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7
Type :
conf
Filename :
6559391
Link To Document :
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