Title :
Development and process optimization of C2W self-alignment & temporary bonding system
Author :
Nakano, Yoshiaki ; Jian Lu ; Takagi, Hiroyuki ; Hayase, Masanori ; Maeda, Ryutaro
Author_Institution :
Tokyo Univ. of Sci., Tokyo, Japan
Abstract :
Size-free MEMS-IC integration is important for MEMS ubiquitous applications as well as to reduce its production cost. In our previous work, we have proposed a 2-step approach for MEMS-IC integration by using chip to wafer (C2W) self-alignment and temporary bonding, and then wafer level permanent bonding. In this work, a prototype system for C2W self-alignment and temporary bonding was developed, and the process parameters, e.g. volume of H2O, wafer temperature, and annealing process, were studied and optimized for better success-ratio and system performance. The results presented in this paper revealed that the proposed system is practically applicable to size-free MEMS-IC integration with reasonably high efficiency.
Keywords :
annealing; hydrogen compounds; micromechanical devices; optimisation; wafer bonding; C2W self-alignment; H2O; MEMS ubiquitous application; annealing process; chip to wafer self-alignment; optimization; production cost reduction; size-free MEMS-IC integration; temporary bonding system; wafer level permanent bonding; wafer temperature; Abstracts; Decision support systems; Films; Silicon;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7