RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings

Author

Giacomozzi, Flavio ; Mulloni, V. ; Colpo, Sabrina ; Faes, A. ; Sordo, Guido ; Girardi, Stefano

Author_Institution

Fondazione Bruno Kessler (FBK), Trento, Italy

fYear

2013

fDate

16-18 April 2013

Firstpage

1

Lastpage

6

Abstract

This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both die-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported showing no loss of functionality but a modification of actuation voltage induced by thermal treatment.

Keywords

coplanar waveguides; electronics packaging; microfabrication; microswitches; quartz; seals (stoppers); CPW lines; RF MEMS chip capping; RF measurement; RF-MEMS device packaging; actuation voltage modification; cap adhesion; capacitive switch; die-to-die capping; epoxy dry film polymer; epoxy polymer sealing rings; fabrication process; functionality loss; insertion loss; ohmic switch; quartz caps; sensitive devices; shear tests; thermal treatment; wafer-to-wafer 0-level capping; Cavity resonators; Coplanar waveguides; Films; Micromechanical devices; Polymers; Radio frequency; Substrates; RF MEMS; chip capping; dry film; epoxy polymer;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on

Conference_Location

Barcelona

Print_ISBN

978-1-4673-4477-7

Type

conf

Filename

6559413