Synthesis of Sn nanoparticles and its size effect on melting point

Author

Yang Ju ; Tasaka, Takafumi ; Yamauchi, Hiroyuki ; Nakagawa, T.

Author_Institution

Dept. of Mech. Sci. & Eng., Nagoya Univ., Nagoya, Japan

fYear

2013

fDate

16-18 April 2013

Firstpage

1

Lastpage

5

Abstract

Recently, the use of Sn-Pb eutectic solder has been prohibited by Restriction of the use of Hazardous Substances (RoHS), since Pb may have a bad influence on human and the environment. Instead, Tin-Silver-Copper (Sn-Ag-Cu) system is adopted as the lead free solder. However, the melting temperature of Sn-Ag-Cu is higher than that of Sn-Pb, which may induce damages in the circuit boards and packages. To solve this problem, Sn nanoparticles are fabricated by the reaction of SnCl2, PVP and aluminum powder. Morphology observation and component analysis of Sn nanoparticles are carried out by field emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM) and energy dispersive X-ray (EDX) spectroscopy, respectively. The melting temperature of Sn nanoparticles is measured by differential scanning calorimeter (DSC822e). The lowest melting temperature of the present Sn nanoparticles is 493.1 K (496.2 K), which is approximately 12 K (9 K) lower than that of the bulk Sn.

Keywords

RoHS compliance; X-ray chemical analysis; aluminium; copper; differential scanning calorimetry; field emission electron microscopy; interconnections; lead; nanoelectronics; nanoparticles; scanning electron microscopy; silver; solders; tin; transmission electron microscopy; DSC822e; EDX; FESEM; PVP; RoHS; Sn-Ag-Cu; TEM; aluminum powder; circuit board; component analysis; differential scanning calorimeter; energy dispersive X-ray spectroscopy; field emission scanning electron microscopy; lead-free solder; melting point; melting temperature; morphology observation; packages; restriction-of-the-use-of-hazardous substances; size effect; temperature 493.1 K; tin nanoparticle synthesis; tin-lead eutectic solder; tin-silver-copper system; transmission electron microscopy; Aluminum; Fabrication; Lead; Nanoparticles; Scanning electron microscopy; Temperature measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on

Conference_Location

Barcelona

Print_ISBN

978-1-4673-4477-7

Type

conf

Filename

6559418