DocumentCode :
618641
Title :
Assembly of super compact wireless sensor nodes for environmental monitoring applications
Author :
Lu, Jun ; Okada, H. ; Itoh, Takayuki ; Maeda, Ryutaro ; Harada, Tatsuya
Author_Institution :
Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), AIST, Tsukuba, Japan
fYear :
2013
fDate :
16-18 April 2013
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents the integration and the assembly of MEMS sensor with RF-IC and flexible RF-antenna, which is expected for the production of super compact and maintenancefree wireless sensor nodes for applications in `green´ sensor networks, e.g. environmental monitoring, electric power consumption controlling. To reduce its size to the lowest possibility, structure and layout of the sensor node was investigated, and then 2 prototypes for humidity and temperature measurement were assembled with the size of a few mm without RF-antenna, and 2×5 cm with flexible RF-antenna. Electric power consumption of the prototype sensor nodes during one cycle of measurement and data transmission was studied. Life-time of the coin battery, which was used as the power source, was calculated and discussed. The practical evaluation results demonstrated that above proposed structure and assemblytechnologies are promising as a platform for super compact and flexible `green´ sensor nodes production.
Keywords :
antennas; assembling; environmental monitoring (geophysics); humidity measurement; integrated circuit design; microsensors; radiofrequency integrated circuits; temperature measurement; wireless sensor networks; MEMS sensor; RFIC; assembly-technology; coin battery; data transmission; electric power consumption control; environmental monitoring application; flexible RF-antenna; green sensor network; humidity measurement; maintenancefree wireless sensor node; size reduction; super compact wireless sensor node; temperature measurement; Assembly; Green products; Micromechanical devices; Power demand; Temperature measurement; Wireless communication; Wireless sensor networks; enviromental monitoring; humidity; low power consumption; maitenance free; super compact; wireless sensor node;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7
Type :
conf
Filename :
6559426
Link To Document :
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