Title :
Synchronized oscillation in micro-mechanically coupled oscillator system: Part II — Non-synchronized super harmonic oscillation
Author :
Nakajima, Masahiro ; Wang, Dong ; Ikehara, T. ; Itoh, Takayuki ; Maeda, Ryutaro
Author_Institution :
Dept. of Mech. Eng., Ibaraki Univ., Hitachi, Japan
Abstract :
A novel oscillation system, which consists of a U-shaped cantilever and a beam-shaped cantilever, was designed, fabricated and characterized for synchronized oscillation-based applications. Two geometrically different cantilevers, with resonant frequencies of 372.503 kHz (detecting) and 182.506 kHz (sensing), are coupled by two coupling overhangs. Under synchronized oscillation, the frequency response was found to double from 182.850 kHz to 365.713 kHz from low frequency cantilever (U-shaped) to high frequency cantilever (beam-shaped). A plateau with a frequency ratio of 2.000 was observed, which corresponds to a stable synchronization region. On the other hand, the super-harmonic oscillation was also demonstrated when the oscillator with higher frequency (beam-shaped) was driven by a higher AC voltage of 4.0 Vpp at approximately half of the primary resonance. In this case, a doubled frequency response of 371.875 kHz can be observed and called as the super-harmonic resonance of 2 degree.
Keywords :
cantilevers; harmonic oscillators; micromechanical devices; oscillators; resonance; U-shaped cantilever; beam shaped cantilever; coupling overhang; frequency 182.506 kHz; frequency 182.850 kHz to 365.713 kHz; frequency 371.875 kHz; frequency 372.503 kHz; frequency response; micromechanically coupled oscillator system; nonsynchronized super harmonic oscillation; oscillation system; resonant frequency; superharmonic resonance; synchronized oscillation; Frequency measurement; Frequency response; Frequency synchronization; Oscillators; Resonant frequency; Synchronization; Vibrations; Coupling overhang; Double region; Nonlinearity; Super-harmonic oscillation; Synchronized oscillation; U-shaped oscillator system; Ultimate sensing;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7