DocumentCode :
618649
Title :
DRIE process modelling — A MEMS case study on a real design
Author :
Pagazani, Julien ; Marty, Frederic ; Babayan, A. ; Hoessinger, A. ; Lissorgues, Gaelle ; Nejim, Ahmed
Author_Institution :
CNAM, Univ. Paris-Est, Noisy le Grand, France
fYear :
2013
fDate :
16-18 April 2013
Firstpage :
1
Lastpage :
3
Abstract :
The aim of this work is to model accurately the DRIE Bosch process used for the MEMS components fabrication. This modelling will permit, depending on the design, to obtain a 3D visualization of the substrate after etching and therefore foresee the real MEMS profile. Another objective is to determine, depending on the modelling accuracy, some process parameters which have been used on the etching equipment to reach such a 3D profile.
Keywords :
micromechanical devices; sputter etching; 3D visualization; DRIE Bosch process; DRIE process modelling; MEMS components fabrication; deep reactive ion etching; etching equipment; substrate; Etching; Fingers; Ions; Micromechanical devices; Silicon; Solid modeling; Substrates; Bosch process; DRIE; MEMS; Micro-fabrication; Process Modelling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7
Type :
conf
Filename :
6559434
Link To Document :
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