• DocumentCode
    618650
  • Title

    Thermal matching designed CMOS mems-based thermoelectric generator for naturally cooling condition

  • Author

    Xiao Yu ; Yanxiang Liu ; Hong Zhou ; Yi Wang ; Tie Li ; Xiuli Gao ; Fei Feng ; Yuelin Wang

  • Author_Institution
    State Key Lab. of Transducer Technol., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
  • fYear
    2013
  • fDate
    16-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a CMOS MEMS-based thermoelectric energy generator device (TEG) used under natural cooling condition with a high output performance. A thermal matching principle is employed for the TEG chip designing and packaging, in which the thermal resistance of the poly-silicon thermopile is approximate to the external thermal load in the system. A wearable device embedded with the TEG chip has been tested in-door when the cold side is naturally cooled by ambient air. The measured results show an open-circuit voltage of as high as 1.6 V and an output power of 0.49 μW when the temperature of the heat source is at 35°C, which makes it to be an applicable wearable TEG device for body warmth converting fabricated by CMOS MEMS-based technology.
  • Keywords
    CMOS integrated circuits; biosensors; cooling; integrated circuit design; micromechanical devices; thermal resistance; thermoelectric conversion; thermopiles; CMOS MEMS-based thermoelectric energy generator devic; TEG chip designing; TEG chip packaging; body warmth; external thermal load; natural cooling condition; open-circuit voltage; poly-silicon thermopile; power 0.49 muW; temperature 35 degC; thermal matching principle; thermal resistance; voltage 1.6 V; wearable TEG device; CMOS integrated circuits; Generators; Immune system; Temperature measurement; Thermal conductivity; Thermal loading; Thermal resistance; CMOS; natural cooling; poly-silicon; thermoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
  • Conference_Location
    Barcelona
  • Print_ISBN
    978-1-4673-4477-7
  • Type

    conf

  • Filename
    6559435