DocumentCode :
618661
Title :
Design of a monolithic 3-axis thermal convective accelerometer
Author :
Huy Binh Nguyen ; Mailly, Frederick ; Latorre, Laurent ; Nouet, Pascal
Author_Institution :
LIRMM, Univ. Montpellier 2, Montpellier, France
fYear :
2013
fDate :
16-18 April 2013
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents the design of a monolithic 3axis thermal accelerometer using a standard CMOS process. Based on free convection in a sealed cavity, the sensing principle is well known and many examples of single and dual-axis MEMS accelerometers can be found in the literature. More recently, Finite Element Modeling has demonstrated the feasibility of a fully integrated 3-axis sensor manufactured with a simple post-process to partially etch silicon bulk of a CMOS die. A prototype was designed and fabricated; this paper presents the sensing cell, its associated conditioning electronics and preliminary characterization.
Keywords :
CMOS integrated circuits; accelerometers; elemental semiconductors; etching; finite element analysis; integrated circuit design; microfabrication; microsensors; monolithic integrated circuits; natural convection; silicon; temperature sensors; Si; cavity sealing; dual-axis MEMS accelerometer; etching; finite element modeling; free convection; fully integrated 3-axis sensor manufacturing; monolithic 3-axis thermal convective accelerometer; standard CMOS process; Acceleration; Accelerometers; Cavity resonators; Heating; Temperature measurement; Temperature sensors; CMOS; Convective accelerometer; MEMS;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7
Type :
conf
Filename :
6559446
Link To Document :
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