Title :
Design and implementation of an on-chip polymer micro ball bearing
Author :
Chih-Chun Lee ; Yu-Che Huang ; Wen-Hsiung Hsiao ; Weileun Fang
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
This study presents a novel design and fabrication process to realize an on-chip micro ball bearing. The ball bearing consists of a polymer-Si-polymer outer-race (stator), and a suspended polymer-Si-polymer inner-disk (rotor) supported by polymer micro-balls. The outer-race and inner-disk are demolded from silicon mold, which is patterned by wet isotropic etching on double-polished 525 μm-thick silicon wafer. The liquid phase photocurable polymer balls are dispensed by commercial dispenser with a hundred micrometer diameter tip and in-situ self-assembled in buffer liquid. After photocurable polymer solidified by UV-curing, the polymer balls are confined between the outer race and inner disk. Note the ball bearing is fabricated on a single wafer with no assembly required.
Keywords :
ball bearings; curing; design engineering; elemental semiconductors; etching; microfabrication; micromechanical devices; polymers; rotors; self-assembly; silicon; solidification; stators; Si-Si; UV-curing; commercial dispenser; double-polished silicon wafer; fabrication process; in-situ self-assembling; liquid phase photocurable polymer balls; on-chip polymer microball bearing design; photocurable polymer solidification; polymer-silicon-polymer outer-race demolding; rotor; silicon mold; size 525 mum; stator; suspended polymer-silicon-polymer inner-disk demolding; wet isotropic etching; Ball bearings; Fabrication; Liquids; Polymers; Rotors; Silicon; Stators; ball bearing; on-chip; polymer;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559719