DocumentCode :
618965
Title :
Surface property study of different patterning sapphire structures by ICP-RIE
Author :
Chun-Ming Chang ; Ming-Hua Shiao ; Donyau Chiang ; Mao-Jung Huang ; Chin-Tien Yang ; Wen-Jeng Hsueh
Author_Institution :
Instrum. Technol. Res. Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
fYear :
2013
fDate :
7-10 April 2013
Firstpage :
372
Lastpage :
375
Abstract :
In this paper, we demonstrate and compare the formation of ordered etching masks for submicron patterned sapphire through use of the nanosphere lithography and nanoimprint lithography methods. Both NSL and NIL were applied to produce the submicron honeycomb network and cone protrusion array structure on the sapphire surface as etching masks. The sequent ICP-RIE technique was applied to further etch the sapphire under the mask. Two types of submicron pattern were obtained on the substrate surface after the etching processes were completed. One type of substrate was the submicron hole array structure and another type was the cone array structure. The working pressure had a considerable effect on the shape geometry and etching rate. The contact angles of the untreated substrate and two differing patterned sapphire substrates were measured and compared. From the contact angle measurement results, we concluded that the protruded contact area dominated the hydrophobic or hydrophilic property.
Keywords :
contact angle; nanofabrication; nanolithography; plasma materials processing; sapphire; sputter etching; Al2O3; ICP-RIE; NIL; NSL; cone protrusion array structure; contact angle; inductively coupled plasma reactive ion etching; nanoimprint lithography methods; nanosphere lithography; ordered etching masks; submicron hole array structure; submicron honeycomb network; submicron patterned sapphire; Arrays; Etching; Nanostructures; Polymers; Substrates; Surface morphology; formatting; style; styling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
Type :
conf
DOI :
10.1109/NEMS.2013.6559754
Filename :
6559754
Link To Document :
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