Title :
High impact-induced failure of a novel solid MEMS switch
Author :
Wang Ying ; Lou Wenzhong ; Zhao Yue ; Wang Fufu
Author_Institution :
State Key Lab. of Mechatron. Eng. & Control, Beijing Inst. of Technol., Beijing, China
Abstract :
Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.
Keywords :
failure analysis; microswitches; reliability; FEM simulation analysis; MEMS initiator market; MEMS initiator reliability; MEMS initiator security; high-impact-induced failure; potential failure modes; solid MEMS switch; Analytical models; Finite element analysis; Micromechanical devices; Microswitches; Solids; Strain; Stress; high impact; leads; reliability; simulation; the novel solid MEMS switch;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559838
