DocumentCode
619080
Title
Cantilever arrayed blood pressure sensor for arterial applanation tonometry
Author
Byeungleul Lee ; Jinwoo Jeong ; ChanSeob Cho ; Jinseok Kim ; Bonghwan Kim ; Hyeon Cheol Kim ; Kukjin Chun
Author_Institution
Mechatron. Eng., Korea Univ. of Technol. & Educ., Cheonan, South Korea
fYear
2013
fDate
7-10 April 2013
Firstpage
907
Lastpage
910
Abstract
We developed a cantilever-arrayed blood pressure sensor array fabricated by (111) silicon bulk-micromachining for the noninvasive and continuous measurement of blood pressure. The blood pressure sensor measures the blood pressure based on the change in resistance of the piezoresistor on a 5-μm-thick-arrayed perforated membrane and 20-μm-thick metal pads. The length and width of the unit membrane are 210 and 310 μm, respectively. The width of the insensible zone between adjacent units is only 10 μm. The resistance change over contact force was measured to verify the performance. The good linearity of the result confirmed that the PDMS package transfers the forces appropriately. The measured sensitivity was about 4.5%/N. The maximum measurement range and resolution of the fabricated blood pressure sensor were greater than 900 mmHg and less than 1 mmHg, respectively.
Keywords
biomedical equipment; biomembranes; blood pressure measurement; blood vessels; cantilevers; force measurement; force sensors; micromachining; piezoresistive devices; pressure sensors; silicon; thick film resistors; two-dimensional digital filters; (111) silicon bulk-micromachining; PDMS package transfers; Si; arterial applanation tonometry; blood pressure measurement; cantilever arrayed blood pressure sensor; contact force; piezoresistor; sensitivity; size 20 mum; thick metal pads; thick-arrayed perforated membrane; Arteries; Biomedical monitoring; Blood pressure; Force; Force sensors; Pressure measurement; Silicon; Blood pressure sensor; PDMS; contact force sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location
Suzhou
Electronic_ISBN
978-1-4673-6351-8
Type
conf
DOI
10.1109/NEMS.2013.6559870
Filename
6559870
Link To Document