• DocumentCode
    619096
  • Title

    Artificial hair cell sensors using liquid metal alloy as piezoresistors

  • Author

    Xiaomei Shi ; Ching-Hsiang Cheng

  • Author_Institution
    Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Hong Kong, China
  • fYear
    2013
  • fDate
    7-10 April 2013
  • Firstpage
    978
  • Lastpage
    981
  • Abstract
    In this paper, we present the design, fabrication process, and testing results of an artificial hair cell sensor made by liquid metal encapsulated in a polydimethylsiloxane (PDMS) substrate. Previously, a flexible force sensor was reported from our group, which can detect both normal and shear forces by using liquid metal alloy (Ga-In-Sn) as piezoresistive gauge material encapsulated in a PDMS substrate. Based on this method, we propose an artificial hair cell sensor which can detect two-axis tactile force with a standing artificial hair shaft. Since the liquid-metal piezoresistors deform with the elastomeric substrate, normal and shear force can be detected with resistance changes of the piezoresistors. Each force sensor comprises a pair of symmetric piezoresistors, which is screen-printed on a suspended PDMS membrane with opposite direction to be sensitive to shear forces. The testing results demonstrate the sensitivity of the force sensor in two-axis directions.
  • Keywords
    force sensors; gallium alloys; indium alloys; liquid alloys; liquid metals; piezoresistive devices; polymers; tactile sensors; tin alloys; Ga-In-Sn; PDMS; artificial hair cell sensor; artificial hair shaft; elastomeric substrate; flexible force sensor; liquid metal alloy; liquid metal encapsulation; liquid metal piezoresistor; piezoresistive gauge material; polydimethylsiloxane substrate; shear force; tactile force; Force; Hair; Liquids; Metals; Piezoresistance; Piezoresistive devices; Sensors; flexible; force sensor; hair cell; liquid metal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
  • Conference_Location
    Suzhou
  • Electronic_ISBN
    978-1-4673-6351-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2013.6559886
  • Filename
    6559886