DocumentCode :
619099
Title :
A micromachined gyroscope with an effective stress-released frame
Author :
Xin Yu ; Wu Xuezhong ; Xiao Dingbang ; Hou Zhanqiang ; He Kun ; Chen Zhihua
Author_Institution :
Coll. of Mechatron. & Autom., Nat. Univ. of Defense Technol., Changsha, China
fYear :
2013
fDate :
7-10 April 2013
Firstpage :
994
Lastpage :
997
Abstract :
Structural stress is one of the main factors that influence the performance of micromachined gyroscopes. This paper mainly analyzed the origin of heat stress and its impact. Then an elastic stress-released frame structure was designed to reduce the heat stress of the micromachined gyroscope. Simulations were done to prove the effect of the novel structure. Also, a dry-wet-etch-combined fabrication method was put forward to fabricate the micromachined gyroscope. Finally, the vacuum property of the gyroscope was tested as well as the scale factor and the bias stability. The scale factor was 50 mV/°/s and the zero bias stability turned out to be 58.60, 35.00 and 31.14 when it started 0 second, 10 minutes and 15 minutes after it was charged.
Keywords :
elasticity; etching; gyroscopes; mechanical stability; microfabrication; micromachining; microsensors; thermal stresses; wetting; dry-wet-etch-combined fabrication method; elastic stress-released frame structure; heat stress reduction; micromachined gyroscope; time 10 min; time 15 min; zero bias stability; Fabrication; Glass; Gyroscopes; Heating; Silicon; Stress; Thermal expansion; Micromachined gyroscope; dry-wet etch; heat stress; vacuum property;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
Type :
conf
DOI :
10.1109/NEMS.2013.6559889
Filename :
6559889
Link To Document :
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