A micromachined gyroscope with an effective stress-released frame

Author

Xin Yu ; Wu Xuezhong ; Xiao Dingbang ; Hou Zhanqiang ; He Kun ; Chen Zhihua

Author_Institution

Coll. of Mechatron. & Autom., Nat. Univ. of Defense Technol., Changsha, China

fYear

2013

fDate

7-10 April 2013

Firstpage

994

Lastpage

997

Abstract

Structural stress is one of the main factors that influence the performance of micromachined gyroscopes. This paper mainly analyzed the origin of heat stress and its impact. Then an elastic stress-released frame structure was designed to reduce the heat stress of the micromachined gyroscope. Simulations were done to prove the effect of the novel structure. Also, a dry-wet-etch-combined fabrication method was put forward to fabricate the micromachined gyroscope. Finally, the vacuum property of the gyroscope was tested as well as the scale factor and the bias stability. The scale factor was 50 mV/°/s and the zero bias stability turned out to be 58.60, 35.00 and 31.14 when it started 0 second, 10 minutes and 15 minutes after it was charged.

Keywords

elasticity; etching; gyroscopes; mechanical stability; microfabrication; micromachining; microsensors; thermal stresses; wetting; dry-wet-etch-combined fabrication method; elastic stress-released frame structure; heat stress reduction; micromachined gyroscope; time 10 min; time 15 min; zero bias stability; Fabrication; Glass; Gyroscopes; Heating; Silicon; Stress; Thermal expansion; Micromachined gyroscope; dry-wet etch; heat stress; vacuum property;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on

Conference_Location

Suzhou

Electronic_ISBN

978-1-4673-6351-8

Type

conf

DOI

10.1109/NEMS.2013.6559889

Filename

6559889