DocumentCode
619326
Title
The effect of modifiers on Poly (lactic acid) properties
Author
Khairrudin, M.G. ; Anwar, M. R. T. Khairol ; Shafian, A.S. ; Sakinah, M.A. ; Suhaiza, H.H.
Author_Institution
Fac. of Chem. Eng., Univ. Technologi MARA, Shah Alam, Malaysia
fYear
2013
fDate
7-9 April 2013
Firstpage
79
Lastpage
84
Abstract
Composites are made of a combination of two or more individual material, produced to increase the mechanical and physical performance of materials. Poly (lactic acid) (PLA) based composite has gained great interest due to its biocompatibility and biodegradability features. However, PLA has its limitations such as brittle behavior, narrow processing techniques, low heat distortion temperature, limited melt strength and poor thermal stability has brought into huge challenge for large-scale usage. To overcome these weaknesses modification of PLA need to be considered which include blending PLA with other polymers or fiber, usage of compatibilizers, additives, plasticizers and crosslinking agents. Modification by blending PLA with fiber is most favorable due to its variety of advantages. However, to obtain optimum compatibility between both PLA and fiber, some modification plus treatment need to be conducted. Thus, this article reviews the modification of PLA to produce high performance composite.
Keywords
additives; biodegradable materials; brittleness; composite materials; filled polymers; plasticisers; polymer blends; thermal stability; additives; biodegradability; brittle behavior; crosslinking agents; heat distortion temperature; limited melt strength; mechanical performance; physical performance; plasticizers; poly(lactic acid)-based composite; polymers; thermal stability; Mechanical factors; Optical fiber dispersion; Plastics; Programmable logic arrays; Surface treatment; Thermal stability; Poly (lactic acid); additives; compatibilizer; crosslinking agent; fiber; plasticizers;
fLanguage
English
Publisher
ieee
Conference_Titel
Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE
Conference_Location
Langkawi
Print_ISBN
978-1-4673-5967-2
Type
conf
DOI
10.1109/BEIAC.2013.6560244
Filename
6560244
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