cMUT probe cooling design by thermal network

Author

Kyungil Cho ; Baehyung Kim ; Youngil Kim ; Seunghun Lee ; Jongkeun Song

Author_Institution

Samsung Adv. Inst. of Technol., Samsung Electron. Co., Yongin, South Korea

fYear

2012

fDate

7-10 Oct. 2012

Firstpage

631

Lastpage

634

Abstract

A cooling system for the cMUT (Capacitance Micro machined Ultrasonic Transducer) probe is designed in efficient way and realized. First, cMUT specific thermal spreader is optimally designed to transport the heat load from the heat source to the heat pipe. Small fins with micro fans for the heat sinks are thermally linked with the heat pipe. Experiments are performed to evaluate the thermal resistances of the each component. Finally, the desired thermal resistance of the heat sink is estimated by using the thermal network analysis, which is realized with the air fans and the fins.

Keywords

capacitive sensors; cooling; fans; microsensors; thermal management (packaging); thermal resistance measurement; ultrasonic transducers; cMUT probe cooling design; capacitance micromachined ultrasonic transducer probe; cooling system; fins; heat load; heat pipe; heat source; microfans; thermal network analysis; thermal resistance evaluation; thermal spreader; Heat sinks; Heating; Probe Cooling; ThermalNetwork; Ultrasound; cMUT;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium (IUS), 2012 IEEE International

Conference_Location

Dresden

ISSN

1948-5719

Print_ISBN

978-1-4673-4561-3

Type

conf

DOI

10.1109/ULTSYM.2012.0157

Filename

6562127