• DocumentCode
    620787
  • Title

    Influence of 1-3 piezocomposite fabrications on lateral modes

  • Author

    Rouffaud, R. ; Hladky-Hennion, A.-C. ; Mai Pham-Thi ; Bantignies, C. ; Levassort, F.

  • Author_Institution
    GREMAN, Tours, France
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Properties of 1-3 piezocomposites with periodic structure were characterized. This material can be typically fabricated in using the ”dice and fill” method (DFM) and two phases were used (PMN-34.5PT ceramic and epoxy resin). The corresponding numerical simulations allowed to study the influence of spurious lateral modes on electromechanical performance of the thickness mode. This was performed in calculating the bandwidth and the sensitivity of the piezocomposite in water (emission-reception) in the frequency range 1-5 MHz. Moreover, three ceramic volume fractions between 25% and 60% were used. Finally, a comparison of these results with those obtained with a pseudo-periodic 1-3 piezocomposite was made. This composite can be fabricated by a lamination technique (LMT) and the use of a pseudo-periodic structure leads to a minimized effect of the lateral modes (confirmed on the simulated electrical impedance). Thanks to these results an optimum structure was discussed.
  • Keywords
    electric impedance; filled polymers; laminations; lead compounds; periodic structures; piezoceramics; piezoelectricity; resins; sensitivity; ultrasonic transducers; 1-3 piezocomposite properties; PMN-34.5PT ceramic; Pb(Mg0.33Nb0.67)O3-PbTiO3; ceramic volume fraction; dice-fill method; electromechanical performance; emission-reception; epoxy resin; frequency 1 MHz to 5 MHz; lamination; lateral modes; numerical simulation; optimum structure; periodic structure; pseudo-periodic 1-3 piezocomposite; sensitivity; simulated electrical impedance; thickness mode; ultrasonic transducers; water; Bandwidth; Ceramics; Impedance; Periodic structures; Sensitivity; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0556
  • Filename
    6562143