• DocumentCode
    620960
  • Title

    A time series analysis technique for effective thermal strain imaging in atherosclerotic plaques by reducing large cardiac motion induced artifacts

  • Author

    Dutta, D. ; Mahmoud, Ahmed ; Kang Kim

  • Author_Institution
    Center for Ultrasound Mol. Imaging & Therapeutics - Heart & Vascular Inst., Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    1189
  • Lastpage
    1192
  • Abstract
    Large lipid pools in vulnerable plaques, in principle, can be detected using thermal strain imaging (TSI). The practical challenge for in vivo cardiovascular application of TSI is that the thermal strain is about an order of magnitude smaller than the peak mechanical strain caused by cardiac pulsation and the former is often masked by the latter. ECG gating is a widely adopted method for motion compensation, but it is often susceptible to electrical and physiological noise. In this paper, we present an ECG-free time series analysis approach to separate the thermal strain from the mechanical strain in in vitro experiments using vessel mimicking phantom where the cardiac pulsation is simulated by a pulsatile pump.
  • Keywords
    bioelectric phenomena; biomedical ultrasonics; blood flow measurement; blood vessels; cardiovascular system; diseases; electrocardiography; flow simulation; lipid bilayers; phantoms; pulsatile flow; thermal noise; time series; ultrasonic imaging; ECG gating; ECG-free time series analysis; atherosclerotic plaques; cardiac motion induced artifacts; cardiac pulsation; electrical noise; in vivo cardiovascular application; lipid pools; motion compensation; peak mechanical strain; physiological noise; pulsatile pump; thermal strain imaging; vessel mimicking phantom; vulnerable plaques; Acoustics; Electrocardiography; Strain; Thermal analysis; Time series analysis; Ultrasonic imaging; Thermal Strain Imaging; Time Series Analysis; Vulnerable Plaque;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0296
  • Filename
    6562484