DocumentCode
620976
Title
Quantitative NDE of the nano-scaled thin film system using SAM
Author
Ik Keun Park ; Tae Sung Park ; Miyasaka, C.
Author_Institution
Seoul Nat. Univ. of Sci. & Technol., Seoul, South Korea
fYear
2012
fDate
7-10 Oct. 2012
Firstpage
1742
Lastpage
1745
Abstract
Nano-scaled thin film systems are applied widely in micro- and/or nano-electro-mechanical systems (MEMS/NEMS). When a nano-scaled thin film is deposited onto the surface of substrate, the elastic properties of the region adjacent to the substrate/film interface differ significantly from those of the respective bulk materials. Therefore, it is important to measure the mechanical properties for the nano-scaled thin film. In this study, we controlled the surface treatment processes to obtain the different adhesive conditions at the interfaces of the systems. Then, we applied acoustic spectroscopy (i.e., V(z) curve technique) to evaluate adhesive strength of the interface. Further, nano-scratch tests were applied to the systems to obtain the correlations between the SA W velocity and the adhesive strength.
Keywords
adhesive bonding; elasticity; micromechanical devices; nanoelectromechanical devices; nanostructured materials; nondestructive testing; surface acoustic wave devices; surface treatment; thin films; MEMS; NEMS; SA W velocity; SAM; acoustic spectroscopy; adhesive strength; curve technique; elastic property; microelectro-mechanical system; nano-electro-mechanical system; nanoscaled thin film system; nanoscratch test; quantitative NDE; substrate-film interface; surface treatment; Acoustics; Adhesives; Copper; Films; Interference; Mechanical factors; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location
Dresden
ISSN
1948-5719
Print_ISBN
978-1-4673-4561-3
Type
conf
DOI
10.1109/ULTSYM.2012.0437
Filename
6562531
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