DocumentCode
621052
Title
Butt-joint built-in (BJB) structure for membrane photonic integration
Author
Inoue, Daisuke ; Jieun Lee ; Shindo, Takatoshi ; Futami, Mitsuaki ; Doi, Kohei ; Amemiya, Tomohiro ; Nishiyama, Naoto ; Arai, Shigehisa
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
fYear
2013
fDate
19-23 May 2013
Firstpage
1
Lastpage
2
Abstract
On-chip optical interconnections have potential for replace global copper wires on LSI chips. I n this work, as an integration method, an OMVPE butt-joint regrowth of 175-nm thick GaInAsP/InP was conducted toward an integration of active and passive components. In the numerical calculation, a coupling efficiency and residual reflection of designed butt-joint coupling were estimated to be 98% and -40 dB, respectively. In the experimental method, we investigated the dependence of butt-joint interface morphology and regrown surface flatness on the side etch depth and the mesa angle. As a result, a flat regrown surface without degradation in crystalline quality was obtained.
Keywords
III-V semiconductors; MOCVD; etching; gallium arsenide; indium compounds; integrated optoelectronics; membranes; numerical analysis; optical interconnections; vapour phase epitaxial growth; wires (electric); BJB structure; GaInAsP-InP; LSI chip; OMVPE butt-joint regrowth; active component; butt-joint built-in structure; butt-joint coupling design; butt-joint interface morphology; coupling efficiency; crystalline quality; flat regrown surface; global copper wire; membrane photonic integration; mesa angle; numerical calculation; on-chip optical interconnection; passive component; regrown surface flatness; residual reflection; side etch depth; size 175 nm; Couplings; Indium phosphide; Optical waveguides; Photonics; Reflection; Surface morphology; Waveguide lasers; OMVPE; butt-joint regrowth; membrane structure; photonic integrated circuit;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
Conference_Location
Kobe
ISSN
1092-8669
Print_ISBN
978-1-4673-6130-9
Electronic_ISBN
1092-8669
Type
conf
DOI
10.1109/ICIPRM.2013.6562623
Filename
6562623
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