Title :
Butt-joint built-in (BJB) structure for membrane photonic integration
Author :
Inoue, Daisuke ; Jieun Lee ; Shindo, Takatoshi ; Futami, Mitsuaki ; Doi, Kohei ; Amemiya, Tomohiro ; Nishiyama, Naoto ; Arai, Shigehisa
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
Abstract :
On-chip optical interconnections have potential for replace global copper wires on LSI chips. I n this work, as an integration method, an OMVPE butt-joint regrowth of 175-nm thick GaInAsP/InP was conducted toward an integration of active and passive components. In the numerical calculation, a coupling efficiency and residual reflection of designed butt-joint coupling were estimated to be 98% and -40 dB, respectively. In the experimental method, we investigated the dependence of butt-joint interface morphology and regrown surface flatness on the side etch depth and the mesa angle. As a result, a flat regrown surface without degradation in crystalline quality was obtained.
Keywords :
III-V semiconductors; MOCVD; etching; gallium arsenide; indium compounds; integrated optoelectronics; membranes; numerical analysis; optical interconnections; vapour phase epitaxial growth; wires (electric); BJB structure; GaInAsP-InP; LSI chip; OMVPE butt-joint regrowth; active component; butt-joint built-in structure; butt-joint coupling design; butt-joint interface morphology; coupling efficiency; crystalline quality; flat regrown surface; global copper wire; membrane photonic integration; mesa angle; numerical calculation; on-chip optical interconnection; passive component; regrown surface flatness; residual reflection; side etch depth; size 175 nm; Couplings; Indium phosphide; Optical waveguides; Photonics; Reflection; Surface morphology; Waveguide lasers; OMVPE; butt-joint regrowth; membrane structure; photonic integrated circuit;
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4673-6130-9
Electronic_ISBN :
1092-8669
DOI :
10.1109/ICIPRM.2013.6562623