Title :
Transmitter PIC for THz applications based on generic integration technology
Author :
Soares, Francisco M. ; Kreissl, Jochen ; Theurer, M. ; Bitincka, E. ; Goebel, T. ; Moehrle, Martin ; Grote, N.
Author_Institution :
Photonics Components Dept., Fraunhofer Inst. for Telecommun., Berlin, Germany
Abstract :
A generic InP based monolithic photonic integration platform is introduced that is capable of simultaneously incorporating transmitter, receiver and passive-optical functionalities. On this basis, an integrated transmitter component for THz applications has been implemented.
Keywords :
III-V semiconductors; indium compounds; integrated optics; microwave photonics; optical receivers; optical transmitters; THz applications; generic integration technology; integrated transmitter component; monolithic photonic integration platform; passive-optical functionalities; receiver; transmitter; transmitter PIC; Integrated optics; Measurement by laser beam; Optical device fabrication; Optical transmitters; Optical waveguides; Photonics; Waveguide lasers; THz transmitter; building blocks; butt-joint technology; component; generic PIC technology; integrated DFB laser;
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4673-6130-9
Electronic_ISBN :
1092-8669
DOI :
10.1109/ICIPRM.2013.6562628
