DocumentCode :
621074
Title :
Sub-50nm indium phosphide high electron mobility transistor technology for terahertz monolithic microwave integrated circuits and systems
Author :
Sarkozy, Stephen ; Xiaobing Mei ; Yoshida, W. ; Po-Hsin Liu ; Ling-Shine Lee ; Zhou, J. ; Leong, Kevin ; Radisic, Vesna ; Deal, William ; Lai, Richard
Author_Institution :
Aerosp. Syst., Northrop Grumman Corp., Redondo Beach, CA, USA
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
1
Lastpage :
2
Abstract :
This paper reports on the process and technology of the sub-50nm InP HEMT MMIC process which has enabled signal amplification up to 670 GHz. In particular, considerations not commonly addressed such as the related processing requirements and uniformity of transistors to establish working chipsets are discussed. Finally, initial burn in data is presented as the technology evolves from a research and development process to production.
Keywords :
III-V semiconductors; field effect MMIC; high electron mobility transistors; indium compounds; submillimetre wave amplifiers; HEMT MMIC process; InP; frequency 670 GHz; high electron mobility transistor; signal amplification; size 50 nm; terahertz monolithic microwave integrated circuits; HEMTs; Indium phosphide; MMICs; MODFETs; Microwave amplifiers; Substrates; HEMT; InP; LNA; PA; THz; Transistor; fmax; mmW;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
Conference_Location :
Kobe
ISSN :
1092-8669
Print_ISBN :
978-1-4673-6130-9
Electronic_ISBN :
1092-8669
Type :
conf
DOI :
10.1109/ICIPRM.2013.6562646
Filename :
6562646
Link To Document :
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