Title :
Table of contents
Abstract :
The following topics are dealt with: CAD; design for manufacture; design for testability; design for yield; low-power electronics; advanced transistors; advanced memory devices; SRAM; radiofrequency integrated circuits; integrated circuit reliability; system-on-chip; system-in-package; and 3D integration.
Keywords :
SRAM chips; circuit CAD; design for manufacture; design for testability; integrated circuit reliability; low-power electronics; radiofrequency integrated circuits; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D integration; CAD; SRAM; advanced memory devices; advanced transistors; design for manufacture; design for testability; design for yield; integrated circuit reliability; low-power electronics; radiofrequency integrated circuits; system-in-package; system-on-chip;
Conference_Titel :
IC Design & Technology (ICICDT), 2013 International Conference on
Conference_Location :
Pavia
Print_ISBN :
978-1-4673-4740-2
Electronic_ISBN :
978-1-4673-4741-9
DOI :
10.1109/ICICDT.2013.6563283
