• DocumentCode
    621421
  • Title

    Embedded resistors in printed circuit board assembly

  • Author

    Shouguo Wang

  • Author_Institution
    Sch. of Inf. Sci. & Technol., Northwest Univ., Xi´an, China
  • fYear
    2013
  • fDate
    23-25 May 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    There are some benefits for embedded passive devices, such as higher reliability by eliminating the solder joint failure from the surface discrete components, real-estate reduction by reducing the physical size of the printed circuit board assembly (PCBA) surface area, better frequency performance by avoiding the inherent parasitic effects from current surface mount technology (SMT). Definitely, embedded passive technology has great potentials on electronic applications, but there are many problems to be resolved at the present stage, one of them is manufacturing processing. The advantages for performing the embedded passive devices in PCBA were discussed firstly. The fabrication processing for embedded resistors in the PCBA was investigated in detail thereafter. The testing results for the embedded resistors fabricated, such as resistance value distribution ranges, relativity standard deviation, product yield, manufacturing tolerance, and control ability for manufacturing process were present lastly, which show the embedded resistors fabricated have the potential to be used in multilayer PCBA in the future.
  • Keywords
    assembling; printed circuit manufacture; printed circuit testing; resistors; surface mount technology; PCBA; SMT; electronic application; embedded passive device; fabricated embedded resistor testing; frequency performance; manufacturing process; multilayer PCBA; printed circuit board assembly; surface discrete component; surface mount technology; Fabrication; Manufacturing processes; Materials; Resistance; Resistors; Testing; PCBA; embedded resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Topics in Electrical Engineering (ATEE), 2013 8th International Symposium on
  • Conference_Location
    Bucharest
  • Print_ISBN
    978-1-4673-5979-5
  • Type

    conf

  • DOI
    10.1109/ATEE.2013.6563465
  • Filename
    6563465