Title :
Design and fabrication of a 5 T NbTi solenoid magnet cooled by a closed-cycle G-M cryocooler
Author :
Dobrin, I. ; Morega, Alexandru Mihail ; Nedelcu, A. ; Morega, Mihaela
Author_Institution :
Appl. Supercond. Lab., Nat. Inst. for Electr. Eng., Bucharest, Romania
Abstract :
This paper presents the superconducting solenoid magnet (SSM) concept, design and construction solutions for a prototype aimed for laboratory applications, which may generate a high magnetic field (5 T) in the central region of the solenoid - the “warm channel”. NbTi wire is used for the field winding. The SSM is contained in a cylindrical case to be kept at safe temperature working conditions by a Gifford-McMahon closed-cycle cryocooler with two cooling stages (50 K and 4.5 K). Mathematical modeling and numerical simulation are used to size thermally the apparatus and to evaluate the “quality” of the magnetic field. Along this line, the thermal loads for the two cooling stages of the cryocooler are evaluated. Two-dimensional models may not produce accurate results so full 3D heat transfer analysis was performed. The pumping power required to keep the SSM within safe operational limits obtained by numerical simulation is in good agreement with available sizing and experimental data.
Keywords :
cooling; finite element analysis; magnetic fields; niobium alloys; superconducting magnets; titanium alloys; windings; wires (electric); 3D heat transfer analysis; Gifford-McMahon closed-cycle cryocooler; NbTi; SSM concept; closed-cycle G-M cryocooler; field winding; high magnetic field quality; magnetic flux density 5 T; mathematical modeling; numerical simulation; pumping power; superconducting solenoid magnet; two-dimensional model; Coils; Heat transfer; High-temperature superconductors; Magnetic fields; Magnetic noise; Magnetic shielding; Superconducting magnets; cryocooler; finite element analysis; high magnetic field; numerical simulation; superconducting magnet; thermal analysis;
Conference_Titel :
Advanced Topics in Electrical Engineering (ATEE), 2013 8th International Symposium on
Conference_Location :
Bucharest
Print_ISBN :
978-1-4673-5979-5
DOI :
10.1109/ATEE.2013.6563476