Title :
Considerations for the use of low-cost substrates for MM-wave packaging
Author :
Aroor, S. ; Henderson, Robert
Author_Institution :
Univ. of Texas at Dallas, Richardson, TX, USA
Abstract :
CMOS technology has enabled the design and fabrication of millimeter-wave integrated circuits at a reasonably low cost. If integrated with a low-cost packaging substrate, high volume fabrication can lead to affordable consumer products. Coplanar waveguide attenuation has been studied on substrates with varying dielectric and metal properties. Challenges, advantages and design considerations are presented that result from using FR-4 substrates to improve the cost of millimeter-wave packages.
Keywords :
MMIC; consumer products; coplanar waveguides; packaging; waveguide attenuators; CMOS technology; FR-4 substrates; MM-wave packaging; consumer products; coplanar waveguide attenuation; design considerations; dielectric property; low-cost packaging substrate; low-cost substrates; metal property; millimeter-wave integrated circuits; millimeter-wave packages; volume fabrication; Attenuation; Coplanar waveguides; Metals; Packaging; Substrates; Transmission line measurements; FR-4; attenuation; coplanar waveguide; packaging; substrates; surface finish;
Conference_Titel :
Wireless and Microwave Circuits and Systems (WMCS), 2013 Texas Symposium on
Conference_Location :
Waco, TX
Print_ISBN :
978-1-4799-0456-3
DOI :
10.1109/WMCaS.2013.6563558
