Improvement of high current density PCB design on a high end server system

In this research project we provide one quick design method for a high current density power distribution board design and improvement on a high end server system. It is based on system power source to sink the current path for design PCB (Printed Circuit Board) copper shape dimension and thickness, and add some power or ground via for stitching each power or ground plane on a multi-layer PCB design to reduce DCR (Direct Current Resistance), and also considers airflow for cooling the power distribution board to make a lower temperature increase with lower power loss and a higher power efficiency with performance per watt.