DocumentCode
621765
Title
Improvement of high current density PCB design on a high end server system
Author
Chen, Hsiao-Chung ; Bai, Ying-Wen
Author_Institution
Graduate Institute of Applied Science and Engineering, Fu Jen Catholic University, Taipei, Taiwan
fYear
2013
fDate
28-31 May 2013
Firstpage
1
Lastpage
4
Abstract
In this research project we provide one quick design method for a high current density power distribution board design and improvement on a high end server system. It is based on system power source to sink the current path for design PCB (Printed Circuit Board) copper shape dimension and thickness, and add some power or ground via for stitching each power or ground plane on a multi-layer PCB design to reduce DCR (Direct Current Resistance), and also considers airflow for cooling the power distribution board to make a lower temperature increase with lower power loss and a higher power efficiency with performance per watt.
Keywords
Copper; Current density; Power distribution; Power supplies; Servers; Shape; Temperature measurement; Current Density; DCR; PCB; Power Efficiency; Temperature Rise;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics (ISIE), 2013 IEEE International Symposium on
Conference_Location
Taipei, Taiwan
ISSN
2163-5137
Print_ISBN
978-1-4673-5194-2
Type
conf
DOI
10.1109/ISIE.2013.6563820
Filename
6563820
Link To Document