• DocumentCode
    62499
  • Title

    High-Density RAM/ROM Macros Using CMOS Gate-Array Base Cells: Hierarchical Verification Technique for Reducing Design Cost

  • Author

    Shibata, Nobutaro ; Gotoh, Yoshinori

  • Author_Institution
    NTT Microsyst. Integration Labs., Atsugi, Japan
  • Volume
    23
  • Issue
    8
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    1415
  • Lastpage
    1428
  • Abstract
    A gate array has a great advantage in that the extra cost required for customizing VLSI masks is low and the lead time needed to obtain an ASIC is short. Hence, it is widely and generally used in the ASIC industry as a major semicustomized VLSI design methodology. This paper presents high-density RAM/ROM macros using memory-oriented CMOS gate-array base cells. The metatile methodology along with a hierarchical verification technique is used for macro design; all the interconnection wires needed to generate a RAM/ROM macro are installed in each physical leaf cell by way of preparation. The macro size is configurable regarding both word count and bit width. Moreover, back annotations after generating a macro are not necessary because there are no unknown factors such as parasitic resistance and/or capacitance. To reduce the power consumption of RAM/ROM macros, six narrow-channel MOSFETs (two pMOSs and four nMOSs) are prepared in the base cell, resulting in a new 10-transistor-type base cell. Using one single base cell, we can implement an SRAM cell (up to two ports), a 4-bit ROM cell, or a 2-input logic gate. When designing the ROM cell, we adopt a double-rail bitline scheme to shorten the bitline delay. Another high-speed technique is to use a new current-mirror sense amplifier. Owing to the high sensitivity (47 mV) of this amplifier, we have successfully reduced the required read bitline signal from 300 to 100 mVpp. With regards to layout techniques, we propose a new high-density address decoder using a subdecoder and complex logic gates. In addition, some verification techniques using phantom base cells are devised. These techniques are confirmed with a gate-array RAM/ROM macro test chip fabricated with a 0.6-μm low cost, CMOS process. With a two-port SRAM with 256 cells/bitline, the address access time under typical conditions of 3.3 V and 25 °C is 7.125 ns and the power-supply current at a 40-MHz operation is 3.8 mA for an I/O-data width of 1 bit.
  • Keywords
    CMOS memory circuits; VLSI; application specific integrated circuits; integrated circuit design; integrated circuit interconnections; masks; random-access storage; read-only storage; ASIC; RAM/ROM macro test chip; RAM/ROM macros; ROM cell; SRAM cell; VLSI design methodology; VLSI masks; double-rail bitline scheme; hierarchical verification technique; interconnection wires; logic gates; macro design; memory-oriented CMOS gate-array base cells; metatile methodology; parasitic capacitance; parasitic resistance; physical leaf cell; reducing design cost; size 0.6 mum; temperature 25 degC; time 7.125 ns; voltage 3.3 V; Arrays; Layout; Logic gates; Read only memory; SRAM cells; Very large scale integration; CMOS; RAM; ROM; gate array; hierarchical verification; high density; high speed; low power; macro; memory-oriented base cell;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2014.2341352
  • Filename
    6894616