DocumentCode
625247
Title
Efficient fault simulation through dynamic binary translation for dependability analysis of embedded software
Author
Di Guglielmo, Giuseppe ; Ferraretto, Davide ; Fummi, F. ; Pravadelli, Graziano
fYear
2013
fDate
27-30 May 2013
Firstpage
1
Lastpage
6
Abstract
Fault injection is fundamental to evaluate the dependability of embedded software. Analyzing the interaction between the software and hardware components when hardware faults occur is efficient, but it is only possible once physical prototypes are available. On the other hand, fault injection on Hardware Description Language (HDL) models is a common practice that can significantly improve the verification phases, but HDL simulation speed constitutes a bottleneck of the design flow. In such a context, executing software on a virtual CPU providing fault-injection capabilities allows engineers to anticipate Embedded Software (ESW) dependability analysis at an earlier design stage. Thus, we present a non-intrusive approach that offers high speed for simulating hardware faults affecting CPU behaviors. This is obtained through dynamic translation of ESW binary code. In this work, hardware fault models (i.e., stuck-at, transient and delay faults) have been abstracted to an instruction-accurate CPU emulator without losing quality for ESW dependability analysis. Experimental results proves both the efficiency and effectiveness of the proposed approach.
Keywords
digital simulation; formal verification; hardware description languages; ESW binary code; HDL simulation; dependability analysis; dynamic binary translation; efficient fault simulation; embedded software; fault injection; fault-injection capabilities; hardware components; hardware description language; physical prototypes; simulating hardware; software components; software execution; verification phases; Adaptation models; Circuit faults; Hardware; Integrated circuit modeling; Microarchitecture; Registers; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ETS), 2013 18th IEEE European
Conference_Location
Avignon
Print_ISBN
978-1-4673-6376-1
Type
conf
DOI
10.1109/ETS.2013.6569351
Filename
6569351
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