Title :
A 1.9nJ/bit, 5Mbps multi-standard ISM band wireless transmitter using fully digital PLL
Author :
Chakraborty, Shiladri ; Parikh, Viral ; Sankaran, S. ; Motos, Tomas ; Prathapan, Indu ; Nagaraj, Kanthi ; Zhang, Fang ; Fikstvedt, Oddgeir ; Smith, Ross ; Sundar, Shyam ; Griffith, D. ; Cruise, P.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
This paper presents an energy efficient transmitter for multi-standard applications (IEEE802.15.4, BLE, 5Mbps) in ISM2.4GHz band. It incorporates a fully digital PLL with two point modulation to achieve upto 5Mbps data rate at 9.5mW power consumption (including all power management blocks) at 0dBm output power, leading to 1.9nJ/b efficiency. The proposed digital PLL uses a counter based area and power efficient re-circulating TDC, current reuse low area DCO using resistive tail, process compensated high speed divider, class-AB PA stages, and fully integrated on-chip LDOs. The entire transmitter occupies 0.35mm2 Silicon area in a 65nm digital CMOS process.
Keywords :
Bluetooth; CMOS digital integrated circuits; digital phase locked loops; dividing circuits; energy conservation; low-power electronics; power amplifiers; radio transmitters; BLE; Bluetooth low energy; IEEE802.15.4; bit rate 5 Mbit/s; class-AB PA stage; counter based area; current reuse; data rate; digital CMOS process; energy efficient transmitter; frequency 4 GHz; fully digital PLL; fully integrated on-chip LDO; low area DCO; multistandard ISM band wireless transmitter; multistandard application; power 9.5 mW; power consumption; power efficient recirculating TDC; power management block; process compensated high speed divider; resistive tail; size 65 nm; two point modulation; Arrays; CMOS integrated circuits; Frequency modulation; Image edge detection; Phase locked loops; Radio transmitters; digital PLL; high data rate loop modulator; low area; multi-standard transmitter; ultra low energy;
Conference_Titel :
Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6059-3
DOI :
10.1109/RFIC.2013.6569526