Title :
Novel silicon-on-insulator SP5T switch-LNA front-end IC enabling concurrent dual-band 256-QAM 802.11ac WLAN radio operations
Author :
Huang, Chun-Wen Paul ; Soricelli, Joe ; Lui Lam ; Doherty, M. ; Antognetti, Paolo ; Vaillancourt, William
Author_Institution :
Skyworks Solutions, Inc., Andover, MA, USA
Abstract :
An innovative SOI SP5T switch-LNA integrated circuit is presented. The switch-LNA consists of a diplexer that provides out-of-band rejection and enables dual-band concurrent operation, a dual-band LNA with bypass attenuators, and three high linearity transmit paths. Tx paths feature 0.1 dB compression at >33 dBm input power, with >35 dB Tx to Rx isolation, and 0.8 and 1.2 dB insertion loss for low and high bands respectively. Receive paths feature 12 dB gain with 2.5-2.8 dB NF. Cascading the design with a dual-band WLAN PA, a complex dual-band front-end module can be easily constructed in a 3 x 4 mm package, which demonstrates transmit and receive LNA linearity with EVM <; 2% at >16 dBm and > - 5dBm output power respectively and compliant with the linearity requirements of the 802.11ac standard up to of 256-QAM 80 MHz operations.
Keywords :
multiplexing equipment; silicon-on-insulator; wireless LAN; SP5T switch-LNA front-end IC; WLAN radio operations; bypass attenuators; diplexer; dual-band concurrent operation; gain 12 dB; input power; loss 0.8 dB; loss 1.2 dB; noise figure 2.5 dB to 2.8 dB; out-of-band rejection; silicon-on-insulator; three high linearity transmit paths; Attenuators; Dual band; Field effect transistors; Finite element analysis; Linearity; Switches; Wireless LAN; Dual-Band WLAN/MIMO/802.11ac front-end ICs; LNA designs; WLAN front-end module; switch designs;
Conference_Titel :
Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6059-3
DOI :
10.1109/RFIC.2013.6569542