Title :
A low-current digitally predistorted 3G-4G transmitter in 40nm CMOS
Author :
Collados, Manel ; Hongli Zhang ; Tenbroek, Bernard ; Hsiang-Hui Chang
Author_Institution :
MediaTek, Inc., West Malling, UK
Abstract :
To create a wide-band transmit path with high current efficiency a single-balanced passive modulator is combined with a class-B single-ended resonant driver. The linearity of such configuration is limited by a strong 3rd harmonic response of the modulator combined with a strong third-order intermodulation in the driver. A novel digital predistortion approach is presented to enable good linearity under these highly non-linear conditions. Implemented in 40nm CMOS, the modulator and driver combined consume only 45mW to deliver a +3dBm Release 99 WCDMA signal with 1.1% EVM, -54dBc ACLR and -160dBc/Hz noise in the RX band. The ACLR remains below -50dBc over temperature, frequency and TX-power without adjustment of the predistortion coefficients. The transmitter delivers +0dBm 10MHz LTE with -51dBc ACLR.
Keywords :
3G mobile communication; 4G mobile communication; CMOS integrated circuits; Long Term Evolution; broadband networks; circuit resonance; code division multiple access; driver circuits; harmonic analysis; intermodulation distortion; low-power electronics; modulators; passive networks; radio transmitters; wavelength division multiplexing; ACLR; CMOS; LTE; RX band; TX-power; WCDMA signal; class-B single-ended resonant driver; configuration linearity; current efficiency; digital predistortion; frequency 10 MHz; harmonic response; low-current digitally predistorted 3G-4G transmitter; power 45 mW; predistortion coefficient; single-balanced passive modulator; size 40 nm; third-order intermodulation; wide-band transmit path; Mixers; Modulation; Multiaccess communication; Polynomials; Predistortion; Spread spectrum communication; Transmitters; CMOS; digital; driver; linearity; modulator; passive; predistortion; transmitter;
Conference_Titel :
Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6059-3
DOI :
10.1109/RFIC.2013.6569544