• DocumentCode
    625462
  • Title

    High efficiency GaN switching converter IC with bootstrap driver for envelope tracking applications

  • Author

    Young-Pyo Hong ; Mukai, Koji ; Gheidi, H. ; Shinjo, Shintaro ; Asbeck, P.M.

  • Author_Institution
    Univ. of California, La, Jolla, La Jolla, CA, USA
  • fYear
    2013
  • fDate
    2-4 June 2013
  • Firstpage
    353
  • Lastpage
    356
  • Abstract
    In this paper, we report a DC/DC converter based on GaN HEMT´s with a switching frequency of 200 MHz that can be used to generate envelope-modulated power supply voltages for use in envelope tracking power amplifiers. The converter consists of switching circuits using 0.25-um GaN HEMTs, inductor, and low pass filter, and can provide output voltages above 28V. An integrated bootstrap driver of the switching circuits is employed in order to reduce DC power consumption of the driver stage. Generation of envelope power supply voltages for 20 MHz LTE signals was demonstrated using 200 MHz switching rates with efficiency of 73%(including dissipation in final and driver stages). The chip size is 1075×990 um2.
  • Keywords
    DC-DC power convertors; III-V semiconductors; Long Term Evolution; bootstrap circuits; driver circuits; gallium compounds; high electron mobility transistors; inductors; low-pass filters; power amplifiers; power consumption; switching convertors; wide band gap semiconductors; DC power consumption; DC/DC converter; GaN; HEMT; LTE signal; chip size; driver stage; efficiency 73 percent; envelope tracking application; envelope tracking power amplifier; envelope-modulated power supply voltage; frequency 20 MHz; frequency 200 MHz; inductor; integrated bootstrap driver; low pass filter; output voltage; size 0.25 mum; switching circuit; switching converter IC; switching frequency; switching rate; Gallium nitride; HEMTs; Power amplifiers; Pulse width modulation; Switches; Switching converters; Switching frequency; Bootstrap; DC/DC converter; GaN; envelope tracking power amplifiers; pulse width modulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4673-6059-3
  • Type

    conf

  • DOI
    10.1109/RFIC.2013.6569602
  • Filename
    6569602