Title : 
Wide-angle camera distortion correction using neural back mapping
         
        
            Author : 
Ching-Han Chen ; Tun-Kai Yao ; Chia-Ming Kuo
         
        
        
        
        
        
            Abstract : 
This study proposes an efficient back mapping model that uses a lightweight neural network and virtual calibration plate to accurately correct the distortion of low quality wide angle camera. Unlike the radial model, the neural-based method uses non-linear functional mapping to model surface distortion, which consists of wide-angle distortion and various manufacturing errors in low-cost cameras. The proposed approach uses a lightweight multilayer feed-forward neural network (MFFNN) with error back-propagation training algorithm to map the complex distortion surface. The optimal number of neurons of hidden layer was assigned as 4 for associating the mapping model between the distortion image space (DIS) with the correction image space (CIS). This study uses a 105 degree wide-angle low-cost camera to test the proposed method. Results show that the maximal corrected error in a whole image is less than 2 pixels, and that the mean square error (MSE) approaches 0.2542 between the corrected and ideal results.
         
        
            Keywords : 
backpropagation; calibration; cameras; distortion; image processing; mean square error methods; multilayer perceptrons; nonlinear functions; CIS; DIS; MFFNN; MSE; complex distortion surface mapping; correction image space; distortion image space; error back-propagation training algorithm; hidden layer neurons; lightweight multilayer feed-forward neural network; manufacturing errors; mean square error; neural back mapping model; nonlinear functional mapping; surface distortion; virtual calibration plate; wide-angle camera distortion correction; Adaptive optics; Cameras; Lenses; Manufacturing; Nonlinear distortion; Optical distortion; Optical imaging;
         
        
        
        
            Conference_Titel : 
Consumer Electronics (ISCE), 2013 IEEE 17th International Symposium on
         
        
            Conference_Location : 
Hsinchu
         
        
        
            Print_ISBN : 
978-1-4673-6198-9
         
        
        
            DOI : 
10.1109/ISCE.2013.6570168