Title :
Soft-IP core design of LVDS receivers for multichannel ultrasound imaging applications
Author :
Song-Nien Tang ; Chien-Ju Lee ; Guo-Zua Wu
Abstract :
In this paper, a soft IP core of LVDS (low-voltage differential signaling) receivers is proposed for multichannel ultrasound imaging systems or other applications. By careful cellbased design, a high-speed de-serializer is developed with control-able bit-shift and delay-adjustment operations. Moreover, using the proposed hybrid coarse-tune and two-level fine-tune schemes, a synchronization controller can perform efficient and robust multichannel LVDS signal synchronizing processes in cooperation with the de-serializer. The proposed LVDS IP core is synthesiz-able cell-based design, which is soft/portable to different circuit technology and system applications. Based on the proposed LVDS structure, four sets of 8-channel LVDS receivers were designed and implemented on a 32-channel FPGA-based ultrasound imag-ing platform. Integrated with the ultrasound AFE/HVFE (analog and high-voltage front-end) module, a throughput of 480 Mb/s per channel can be achieved for test patterns, 32-channel ultrasound image and color-Doppler display.
Keywords :
field programmable gate arrays; logic circuits; microprocessor chips; ultrasonic imaging; 32-channel FPGA-based ultrasound imaging platform; 8-channel LVDS receivers; LVDS IP core; LVDS receiver; analog front-end; bit rate 480 Mbit/s; color-Doppler display; controlable bit-shift operation; delay-adjustment operation; high-speed de-serializer; high-voltage front-end; hybrid coarse-tune-two-level fine-tune scheme; low-voltage differential signaling receivers; multichannel LVDS signal synchronizing process; multichannel ultrasound imaging application; soft-IP core design; synchronization controller; synthesizable cell-based design; test patterns; ultrasound AFE-HVFE module; Doppler effect; IP networks; Imaging; Process control; Receivers; Synchronization; Ultrasonic imaging;
Conference_Titel :
Consumer Electronics (ISCE), 2013 IEEE 17th International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4673-6198-9
DOI :
10.1109/ISCE.2013.6570202