• DocumentCode
    626030
  • Title

    220 GHz ultra wide band TWTA: Nano CNC fabrication and RF testing

  • Author

    Baig, Adeel ; Gamzina, Diana ; Barchfeld, Robert ; Jinfeng Zhao ; Domier, Ivin ; Spear, Alexander ; Barnett, L.R. ; Luhmann, Neville C.

  • Author_Institution
    Dept. of Electr. & Co. mputer Eng., Univ. of California, Davis, Davis, CA, USA
  • fYear
    2013
  • fDate
    21-23 May 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Precision fabrication and RF testing of a 220 GHz GHz sheet beam TWTA based on the double vane half-period staggered slow wave structure design[1]is reported. NanoCNC Milling technology[2] was employed to precision fabricate the entire TWTA circuit in bulk copper, incorporating input and output couplers, sever ports, and the slow wave structure with matching. To accommodate an overhead input/output coupler design, the TWTA circuit was fabricated in a three layer process with dimensional tolerance of within ~1-2 μm and surface roughness ~50 nm. The TWTA circuit was diffusion bonded (at UC Davis) within an accuracy of less than 10 μm between two circuit halves. Initial TWTA cold tests employing a BWO based scalar network analyzer showed an in-band insert ion loss of ~ -5 dB with a bandwidth exceeding 50 GHz. The in-band return loss was <; -12 dB. These measurements were subsequently confirmed using an Agilent PNA-X VNA. The hot test setup is ready to test the TWTA being baked at CPI and the latest test results will be presented at the conference and added to the abstract.
  • Keywords
    circuit testing; diffusion bonding; millimetre wave amplifiers; nanofabrication; slow wave structures; travelling wave amplifiers; ultra wideband technology; waveguide couplers; Agilent P NA-X VNA; BWO based scalar network analyzer; CPI; NanoCNC milling technology; RF testing; bulk copper; diffusion bonded TWTA circuit; frequency 220 GHz; hot test setup; inband insert ion loss; overhead input output coupler design; precision fabrication; sever ports; sheet beam TWTA; slow wave structure; surface roughness; ultrawide band TWTA; Bandwidth; Cathodes; Computer numerical control; Couplers; Current density; Fabrication; Radio frequency; MEMS/Nano-CNC precision fabrication; Microwave Power Module (MPM); PIC; THz; TWTA;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference (IVEC), 2013 IEEE 14th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-5976-4
  • Type

    conf

  • DOI
    10.1109/IVEC.2013.6571007
  • Filename
    6571007