• DocumentCode
    626031
  • Title

    Plasma-tunable metamaterials and periodic structures

  • Author

    Chien-Hao Liu ; Behdad, Nader

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
  • fYear
    2013
  • fDate
    21-23 May 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, we examine methods in which plasmas can be used to tune the responses of RF/microwave periodic structures and artificially-engineered materials. In particular, we exploit microwave-induced plasmas created in periodic structures when the power of the incident electromagnetic wave exceeds the breakdown threshold power level. Based on the nature of the plasma created within the unit cell of a periodic structure, the structure can either be physically reconfigured or its impedance can be changed continuously. The former phenomenon results in a reconfigurable (or switchable) periodic structure and the latter results in a tunable one. We examine this phenomenon in several planar periodic structures, which are designed to be opaque at microwave frequencies. We demonstrate that these structures can be made transparent when the devices are driven to breakdown in air at atmospheric pressure. We also discuss the behavior of these structures when the plasma is created in Argon at different pressure levels.
  • Keywords
    argon; electric breakdown; electromagnetic metamaterials; RF/microwave periodic structures; artificially-engineered materials; breakdown threshold power level; incident electromagnetic wave; plasma-tunable metamaterials; reconfigurable periodic structure; Argon; Atmospheric measurements; Electric breakdown; Metamaterials; Periodic structures; Plasmas; Radio frequency; electromagnetic breakdown; metamaterials; periodic structures; streaming plasma;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference (IVEC), 2013 IEEE 14th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-5976-4
  • Type

    conf

  • DOI
    10.1109/IVEC.2013.6571008
  • Filename
    6571008