• DocumentCode
    626120
  • Title

    Parallel 2D large-signal modeling of cascaded TWT amplifiers

  • Author

    Chernyavskiy, Igor A. ; Vlasov, Alexander N. ; Levush, Baruch ; Antonsen, Thomas M. ; Nguyen, Khanh T.

  • Author_Institution
    Naval Res. Lab., Washington, DC, USA
  • fYear
    2013
  • fDate
    21-23 May 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The 2.5D large-signal code TESLA-FW was recently developed with the goal to model TWT amplifiers based on the serpentine or folded-waveguide slow-wave structures. Predictions of the large-signal code, applied to the modeling of the single stage amplifiers, were found in a good agreement with the results of the 3D PIC code MAGIC, while its run-time was on orders of magnitude less. To extend applicability of the large-signal code, now we report its conversion into a parallel version, which allows us concurrently model all the stages of a multiple-beam cascaded TWT amplifiers based on serpentine or folded-waveguide slow-wave structures. Newly introduced parallel version of TESLA-FW is applied to model a 3stage cascaded TWT amplifier to support on-going efforts on its design and further optimization. Obtained results are compared with the predictions of the 3D PIC code MAGIC.
  • Keywords
    optimisation; slow wave structures; travelling wave amplifiers; waveguides; 2.5D large-signal code TESLA-FW parallel version; 3D PIC code MAGIC; folded-waveguide slow-wave structure; multiple-beam cascaded TWT amplifier; optimization; parallel 2D large-signal modeling; serpentine slow-wave structure; single stage amplifier; Computational modeling; Electron beams; Electron tubes; Load modeling; Power amplifiers; Power generation; Solid modeling; broadband high power amplifier; folded waveguide slow-wave structure; large-signal code; parallel modeling; serpentine slow-wave structure; traveling-wave tube;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference (IVEC), 2013 IEEE 14th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-5976-4
  • Type

    conf

  • DOI
    10.1109/IVEC.2013.6571119
  • Filename
    6571119