DocumentCode :
626473
Title :
Challenge of MTJ/MOS-hybrid logic-in-memory architecture for nonvolatile VLSI processor
Author :
Hanyu, Takahiro
Author_Institution :
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
117
Lastpage :
120
Abstract :
A new logic-circuit style based on nonvolatile logic-in-memory architecture is proposed for realizing compact, low-power logic and highly reliable VLSI processors with parallel data accessibility. Since nonvolatile storage elements such as magnetic tunnel junction (MTJ) devices are distributed over a logic-circuit plane in the proposed style, wide memory bandwidth as well as instant power gating without escaping/reloading data can be realized. As typical examples, and an MTJ-based nonvolatile Ternary Content-Addressable Memory, an MTJ-based nonvolatile look-up table circuit for an instant power-ON/OFF field programmable gate array and a post-process variation-resilient logic-circuit design using MTJ devices are implemented and their superior performances are demonstrated in comparison with a corresponding CMOS-only-based realization.
Keywords :
MOS integrated circuits; MRAM devices; VLSI; content-addressable storage; field programmable gate arrays; integrated circuit design; integrated circuit reliability; logic circuits; logic design; low-power electronics; magnetic tunnelling; random-access storage; table lookup; ternary logic; CMOS-only-based realization; MTJ-MOS-hybrid logic-in-memory architecture; escaping-reloading data; instant power gating; instant power-ON-OFF field programmable gate array; logic-circuit style; magnetic tunnel junction device; nonvolatile VLSI processor; nonvolatile look-up table circuit; nonvolatile storage element; nonvolatile ternary content-addressable memory; parallel data accessibility; post-process variation-resilient logic-circuit design; reliability; Logic gates; Magnetic tunneling; Nonvolatile memory; Table lookup; Transistors; Very large scale integration; field-programmable gate array (FPGA); magnetco-resistive RAM (MRAM); process-temperature-voltage (PVT) variation; ternary content-addressable memory (TCAM);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6571796
Filename :
6571796
Link To Document :
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