• DocumentCode
    626483
  • Title

    High-order multi-bit incremental converter with Smart-DEM algorithm

  • Author

    Yao Liu ; Bonizzoni, Edoardo ; Maloberti, Franco

  • Author_Institution
    Dipt. di Ing. Ind. e dell´Inf., Univ. of Pavia, Pavia, Italy
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    This paper describes the design method for highorder multi-bit incremental converters aiming at high resolution (> 14 bits) with Smart-DEM algorithm. Traditional 2nd and 3rd-order incremental ADCs use 1-bit quantizer. These structures lead to long conversion time for each sample to achieve the expected resolution and high power consumption due to the large output swing of the op-amps. Also, the fractional coefficients along the accumulation path that avoid instability degrade the performance. On the contrary, modulators employing multi-bit quantizer and DAC do not suffer from these problems. Although the mismatch of unity elements in the DAC causes non-linearity issue, this can be suppressed by Smart-DEM algorithm. Because the Smart-DEM algorithm is quite compact and easy to implement, the modulator benefits extra bits performance directly from the multi-bit DAC with affordable digital circuits overhead. In this paper several structures for incremental ADCs utilizing multi-bit quantizer are presented. The positive-and-negative DAC and the Smart-DEM algorithm are explained. With 3-bit quantizer, the simulation results show that the 2nd-order incremental ADC obtains 18-bit resolution with 256 clock periods.
  • Keywords
    analogue-digital conversion; digital-analogue conversion; digital-analog converter; extra bit performance; high order multibit incremental converter; incremental analog-digital converter; multibit DAC; multibit quantizer; negative DAC; nonlinearity issue; positive DAC; smart DEM algorithm; unity element mismatch; Algorithm design and analysis; Clocks; Guidelines; Linearity; Modulation; Sigma-delta modulation; Signal resolution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6571806
  • Filename
    6571806