Title :
Exploring early design tradeoffs in 3DIC
Author :
Franzon, Paul D. ; Priyadarshi, Shekhar ; Lipa, Steve ; Davis, William Rhett ; Thorolfsson, Thor
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
This The key to gaining substantial benefit from the use of 3DIC technology is to create 3D specific designs that do more than recast a 2D optimal design into the third dimension. This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration. The power advantages of 3D design are illustrated in details. Results from different partitioning approaches (function, modular and circuit) are presented, together with early results from a thermal pathfinding tool.
Keywords :
circuit CAD; integrated circuit design; three-dimensional integrated circuits; 3D specific designs; 3DIC technology; CAD tools; circuit partitioning; function partitioning; modular partitioning; partitioning approaches; thermal pathfinding tool; Bandwidth; Face; Integrated circuit interconnections; Random access memory; Silicon; Through-silicon vias; Wires;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6571901
