• DocumentCode
    626710
  • Title

    A portable lab-on-chip platform for magnetic beads density measuring

  • Author

    Yushan Zheng ; Jacquemod, Cyril ; Sawan, Mohamad

  • Author_Institution
    Dept. of Electr. Eng., Polytech. Montreal, Montreal, QC, Canada
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    1071
  • Lastpage
    1074
  • Abstract
    We propose in this paper a portable lab-on-chip (LoC) platform dedicated for magnetic beads density measuring. The device consists of two main parts: disposable microfluidic structure and reusable electronic part. With results displayed on build-in LCD screen, the conventional bulky observation equipment is avoided. The principle of detection is that the presence of magnetic beads can affect the effective inductance of planar microcoil integrated inside of the LoC platform. In order to read out the inductance variation, we proposed a CMOS 0.18um application specific integrated circuit, which includes two different sensing blocks, namely impedance sensing and frequency sensing circuit. Preliminary experimental results with magnetic beads show that our proposed LoC platform allows measuring the density of magnetic beads in a wide range with fine linearity, either in continuous-flow microfluidics or digital mcirofluidics.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; coils; lab-on-a-chip; liquid crystal displays; microfluidics; CMOS application specific integrated circuit; build-in LCD screen; continuous-flow microfluidics; conventional bulky observation equipment; detection principle; digital mcirofluidics; disposable microfluidic structure; frequency sensing circuit; impedance sensing circuit; inductance variation; magnetic bead density measurement; planar microcoil inductance; portable LoC platform; portable lab-on-chip platform; reusable electronic part; sensing blocks; Arrays; Coils; Impedance; Inductance; Magnetic circuits; Microfluidics; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572035
  • Filename
    6572035