Title :
An MTJ-based nonvolatile associative memory architecture with intelligent power-saving scheme for high-speed low-power recognition applications
Author :
Yitao Ma ; Shibata, Takuma ; Endoh, Tetsuo
Author_Institution :
Center for Interdiscipl. Res., Tohoku Univ., Sendai, Japan
Abstract :
A nonvolatile associative memory architecture based on the Magnetic Tunnel Junction (MTJ) devices has been proposed for high-speed low-power recognition. In order to reduce the power dissipation without sacrificing the speed performance, an intelligent power-saving scheme has been developed taking the advantage of non-volatility of MTJ devices. The power lines of 4-Transistor 2-MTJ nonvolatile memory cells are controlled by not only word line signals but also the internal power control signals supplied from the data-mask/power-gating units to only activate the currently accessed memory elements. The proof-of-concept chip for 128-dimension data vectors has been designed under a 90-nm 5-metal CMOS/MTJ hybrid technology, and the chip operation at 100MHz has been verified by SPICE simulation. Compared to the conventional 6T-SRAM architecture, the proposed architecture achieves the higher speed and up to 97% power reduction. Moreover, this architecture is also proved to be particularly suitable for the applications with higher dimension data vectors.
Keywords :
CMOS memory circuits; SPICE; low-power electronics; magnetic tunnelling; random-access storage; 128-dimension data vectors; 4-transistor 2-MTJ nonvolatile memory cells; 5-metal CMOS-MTJ hybrid technology; 6T-SRAM architecture; MTJ-based nonvolatile associative memory architecture; SPICE simulation; data-mask-power-gating units; frequency 100 MHz; high-speed low-power recognition applications; intelligent power-saving scheme; internal power control signals; magnetic tunnel junction devices; memory elements; nonvolatile associative memory architecture; power dissipation; power lines; size 90 nm; Computer architecture; Magnetic tunneling; Nonvolatile memory; Power demand; Resistance; SPICE; Vectors;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6572079