DocumentCode :
626777
Title :
Parallel interleaver architecture with new scheduling scheme for high throughput configurable turbo decoder
Author :
Guohui Wang ; Vosoughi, Aida ; Hao Shen ; Cavallaro, J.R. ; Yuanbin Guo
Author_Institution :
Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
1340
Lastpage :
1343
Abstract :
Parallel architecture is required for high throughput turbo decoder to meet the data rate requirements of the emerging wireless communication systems. However, due to the severe memory conflict problem caused by parallel architectures, the interleaver design has become a major challenge that limits the achievable throughput. Moreover, the high complexity of the interleaver algorithm makes the parallel interleaving address generation hardware very difficult to implement. In this paper, we propose a parallel interleaver architecture that can generate multiple interleaving addresses on-the-fly. We devised a novel scheduling scheme with which we can use more efficient buffer structures to eliminate memory contention. The synthesis results show that the proposed architecture with the new scheduling scheme can significantly reduce memory usage and hardware complexity. The proposed architecture also shows great flexibility and scalability compared to prior work.
Keywords :
decoding; parallel architectures; turbo codes; buffer structures; data rate requirement; hardware complexity reduction; high-throughput configurable turbo decoder; memory conflict problem; memory contention elimination; memory usage reduction; parallel interleaver architecture; parallel interleaving address generation hardware; scheduling scheme; wireless communication system; Clocks; Computer architecture; Decoding; Hardware; Parallel processing; Throughput; Writing; HSPA+; VLSI; contention-free; high throughput; memory conflict; parallel interleaver; parallel processing; turbo decoder;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6572102
Filename :
6572102
Link To Document :
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