DocumentCode :
626805
Title :
Multiple-pulse dynamic stability and failure analysis of low-voltage 6T-SRAM bitcells in 28nm UTBB-FDSOI
Author :
Akyel, Kaya Can ; Ciampolini, L. ; Thomas, O. ; Pelloux-Prayer, B. ; Kumar, Sudhakar ; Flatresse, Philippe ; Lecocq, Claire ; Ghibaudo, Gerard
Author_Institution :
STMicroelectron., CCDS, Crolles, France
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
1452
Lastpage :
1455
Abstract :
This work investigates the effects of process variability on the dynamic stability of a 6-Transistor Static Random Access Memory bitcell manufactured in 28nm Ultra-Thin Body and Buried Oxide Fully-Depleted Silicon-On-Insulator (UTBB-FDSOI) technology node. The study is carried out for two different well architectures: single-well (peculiar to UTBB-FDSOI) and dual-well (like in standard CMOS), through Most-Probable Failure Point tracking methodology coupled with Importance Sampling. Different failure mechanisms appearing under different operating conditions are discussed. We show that the Read-After-Write failure criterion based on multiple Word-Line pulses is the most accurate way to evaluate bitcell failure rate and thus its yield under realistic dynamic conditions. The methodology exposed in this work is applied to demonstrate the superior properties of the single-well architecture.
Keywords :
SRAM chips; circuit stability; failure analysis; importance sampling; silicon-on-insulator; UTBB-FDSOI technology node; dual-well; importance sampling; low-voltage 6T-SRAM bitcells; most-probable failure point tracking methodology; multiple word-line pulses; multiple-pulse dynamic stability; operating conditions; read-after-write failure criterion; single-well architecture; size 28 nm; standard CMOS; static random access memory; ultra-thin body and buried oxide fully-depleted silicon-on-insulator; Computer architecture; Failure analysis; Integrated circuit modeling; Monte Carlo methods; Random access memory; Stability criteria;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6572130
Filename :
6572130
Link To Document :
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