• DocumentCode
    626938
  • Title

    A 3rd-order delta-sigma modulator with timing-sharing opamp-sharing technique

  • Author

    I-Jen Chao ; Chia-Ming Kuo ; Bin-Da Liu ; Chun-Yueh Huang ; Soon-Jyh Chang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    2002
  • Lastpage
    2005
  • Abstract
    This paper proposes a 3rd-order low-distortion delta-sigma modulator (DSM) structure, which uses the timing-sharing technique between the 2nd and 3rd integrators during one clock phase. Further, since the operation phase of the 1st integrator is different to those of the 2nd and 3rd integrators, the three integrators are realized in just single opamp by the opamp sharing. Therefore, the power consumption can be reduced greatly. Besides, the proposed DSM structure poses the feature of relaxed feedback timing. The quantization and DEM operation can be extended from a non-overlapping interval for a conventional low-distortion structure to half of the clock period. The proposed 3rd-order 4-bit DSM is implemented in a 90-nm CMOS process. Post-layout simulation shows that the modulator achieves 75.1-dB SNDR with 2.5-MHz input signal bandwidth and 80-MHz sampling frequency. The power consumption is only 1.42 mW with 61.1-fJ/conversion-step FOM, and the core area is 683 × 592 μm2.
  • Keywords
    CMOS digital integrated circuits; delta-sigma modulation; integrated circuit layout; operational amplifiers; 3rd-order low-distortion DSM structure; 3rd-order low-distortion delta-sigma modulator structure; CMOS process; DEM operation; bandwidth 2.5 MHz; clock phase; frequency 80 MHz; integrators; post-layout simulation; power 1.42 mW; power consumption reduction; quantization; relaxed feedback timing; size 90 nm; timing-sharing opamp-sharing technique; Adders; Capacitors; Clocks; Modulation; Noise; Quantization (signal); Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572263
  • Filename
    6572263