DocumentCode :
626957
Title :
Power analysis attack of QCA circuits: A case study of the Serpent cipher
Author :
Weiqiang Liu ; Srivastava, Sanjeev ; Liang Lu ; O´Neill, Maire ; Swartzlander, Earl E.
Author_Institution :
ECIT, Queen´s Univ. Belfast, Belfast, UK
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
2075
Lastpage :
2078
Abstract :
Quantum-dot cellular automata (QCA) technology is an attractive alternative to CMOS for future digital designs. A powerful attack based on power analysis has become a significant threat to the security of CMOS cryptographic circuits. As there is no current flow in QCA, the power consumption of a QCA circuit is extremely low compared to its CMOS counterpart. Therefore, in this paper an investigation is carried out to ascertain if QCA circuits could be immune to power analysis attacks based on a case study of the Serpent cipher. In comparison to a previous design, the proposed QCA implementation of a sub-module of the Serpent cipher is more efficient in terms of complexity, area and latency. By using an upper bound power model, the first power analysis attack of a QCA cryptographic circuit is presented. Simulation results show that even though the power consumption is low, it can still be correlated with the correct key guess, and all possible subkeys applied to the Serpent sub-module can be revealed in a best case scenario for attackers. The security of practical QCA devices is also discussed and could be greatly improved by applying a smoother clock.
Keywords :
cellular automata; circuit complexity; cryptography; power supplies to apparatus; quantum dots; CMOS cryptographic circuits; QCA cryptographic circuit; QCA technology; Serpent submodule; correct key guess; digital designs; power analysis attack; power consumption; quantum-dot cellular automata technology; serpent cipher; upper bound power model; Ciphers; Clocks; Integrated circuit modeling; Power demand; Quantum dots; Upper bound;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6572282
Filename :
6572282
Link To Document :
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